BGA Rework Stations

Features:

1.The integrated design of hot air head and placement head has the functions of automatic placement, automatic welding and automatic disassembly;

2.The upper wind head adopts a hot air system, which has a fast temperature rise, uniform temperature, and fast cooling (50-80 degrees can be suddenly dropped when the temperature is lowered), which can better meet the process requirements of lead-free soldering. The lower hot temperature zone adopts infrared + hot air mixed heating. Infrared directly acts on the heating area and conducts with the hot air at the same time, which can make up for each other’s deficiencies and make the PCB heat up quickly (heating rate reaches 10 ° C / S), while the temperature remains uniform;

3.Independent three temperature zones (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and the lower temperature zone realize synchronous automatic movement, and can automatically reach any position in the bottom infrared preheating zone. The lower temperature zone can move up and down, support the PCB, and adopt automatic motor control. Realize that the PCB does not move on the fixture, and the upper and lower heating heads can be moved to the target chip of the PCB;

4.PCB card board adopts high-precision slider to ensure the placement accuracy of BGA and PCB board;

5.The original bottom preheating platform adopts excellent heating materials imported from Germany (infrared gold-plated light tube) + anti-glare constant temperature glass (temperature resistance up to 1800 ℃). The preheating area reaches 500 * 420mm;

6.The preheating platform, clamping plate device and cooling system can move in the X direction as a whole. Make PCB positioning and folding welding safer and more convenient;

7.X, Y adopts the motor automatic control movement mode, which makes the positioning fast and convenient, the equipment space is fully utilized, and the ultra-large area PCB is repaired with a relatively small equipment volume, the maximum splint size can reach 510 * 480mm, and there is no corner for repair

8.Double rocker control, alignment lens and upper and lower heating platform to ensure alignment accuracy;

9.Built-in vacuum pump, φ angle rotation, precise fine adjustment of mounting nozzle;

10.The suction nozzle automatically recognizes the suction material and the mounting height, and the pressure can be controlled within a tiny range of 10 grams. It has 0 pressure suction and mounting functions for small chips;

11.The color optical vision system has manual X, Y direction movement, with split-color, magnification and fine-tuning functions, including color difference resolution device, auto focus, software operation function, and can be repaired with a maximum BGA size of 80 * 80 mm;

12.Various sizes of alloy hot air nozzles are easy to replace and can be rotated and positioned 360 °;

13.Configure 5 temperature measurement ports, with multi-point real-time temperature monitoring and analysis function;

14.With solid state operation display function, making temperature control more safe and reliable;

15.The machine can automatically generate the SMT standard temperature disassembly curve at different temperatures in different regions, without manually setting the machine curve, and can be used by experienced operators to achieve machine intelligence;

16.With a camera to observe the melting point of the side of the solder ball, it is convenient to determine the curve (this function is optional).

Specifications:

OBSMT， focus on the SMT &DIP machines for more than 15 years