

Mini wave soldering machine , welding the DIP ,THT chips. Economic one .
Features
1.Solder furnace using alloy materials.Special aluminum rail high strength and hardness, longer lifespan.
2.PLC + touch screen control technology to ensure system reliability and stability.
3.Equipped with a cooling module, temperature compensation module for unleaded and a variety of process requirements.
4.Imported miniature chemical pumps, propanol cleaners, automatic cleaning cycle chain claws.
5.Suitable for the small quantity production.
Specifications
| Model | OB-W330 |
| PCB transport height | Max.760 ± 10mm |
| PCB transport direction | L-R or R-L (optional) |
| PCB transport speed | 0-2.0m/min |
| PCB Working width | 0 ~ 25 0mm adjustable (standard type) |
| Preheating zone length | 600mm |
| Preheating zone number | 1 |
| Preheating temperature | Room temperature ~ 250 ℃ |
| Power for preheating | 3kw |
| Conveyor path gradient | 3 ~ 7 ° |
| Solder type | Lead-free solder / ordinary solder |
| Solder volume | 130 – 160kg |
| Solder temperature | Room temperature ~ 350 ± 1 ℃ |
| Power for solder tin stove | 6 kw |
| Temperature control type | PID |
| Solder fluxes | 10 ~ 100ml/min |
| Refrigeration temperature | Below 10 ℃ |
| Sprayer Moving type | SMC rodless cylinder |
| Power | 3P 380V 5W |
| Weight | Approx.300Kgs |
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